How to work a pick and place machine?

After applying solder paste onto the printed circuit board, the next crucial step involves placing components accurately atop the paste. This process can either be executed manually or by utilizing a machine designed for this purpose. Employing tweezers is a common method for manual placement of components. However, there exists a widespread misconception that manufacturing electronics necessitates large and costly machinery. This is not entirely accurate! Humans can quite efficiently place components, as the surface tension of molten solder typically allows components to align themselves correctly during the reflow process. Nevertheless, the human element has its limitations; fatigue sets in after continuous work, causing a decline in speed and efficiency, especially when dealing with tiny components that strain the eyes.

A pick and place machine is essential not for basic electronics assembly but for large-scale production.

SparkFun originally focused on manual component placement, a practice we still maintain! However, when the production quantity exceeds one hundred units, we turn to a pick and place machine to enhance our production capabilities effectively.

The Functionality of a Pick and Place Machine

A pick and place machine (PNP) is a sophisticated assembly device that employs a vacuum mechanism to pick components from adhesive tape, or another source, rotate them into the correct orientation, and place them accurately on the circuit board. Setting up a pick and place machine typically takes a few hours, yet the operational speed is remarkably high once it is ready.

In larger manufacturing environments, a conveyor belt usually transports the circuit board directly from an automated solder paste application station to pick-and-place machines, whereas at SparkFun, we rely on manual transportation of our boards across the production area.

Here, Bob presents SparkFun's advanced MYDATA PNP machine, showcasing its impressive capabilities.

For additional insights, please explore Pick and Place Maschine.

This insightful video from Z-AXIS details our SMT pick and place process. Surface mount technology (SMT) enables the direct mounting of components onto the surface of printed circuit boards and is a key component of our PCBA assembly services.

From Design to Assembly

Prior to the surface mount pick and place stage, Z-AXIS’ electrical engineering team is available to design or assist in designing your circuit. Our electronics design services involve crafting detailed board layouts that specify component placements and tracing routes.

Following this layout, we procure printed circuit boards with the necessary circuitry, including a solder paste stencil and all required components.

Understanding SMT Pick and Place Mechanics

With everything set, we can commence SMT assembly. Z-AXIS utilizes high-speed and high-mix SMT assembly lines, equipped with Mycronic machines that are expressly designed for flexibility, allowing rapid transitions between different products and efficiently handling a range of production volumes.

Initially, these boards are processed through an automatic stencil printer that applies a layer of solder paste onto the circuit. This paste comprises minuscule metal beads suspended in a tacky flux that adheres to the circuit board's metal areas.

Components Feeding and Vision Systems in SMT

Next, the boards enter into the SMT pick and place machine, where nozzles utilize vacuum pressure to lift components from their feeders and place them into the corresponding solder paste on the board. These machines generally feature dual-head configurations, allowing each head to pick up eight components simultaneously, place them, and return for the next batch.

The red flashes you see in the accompanying video are part of the machine vision system, capturing images of the components to ensure that each nozzle properly aligns with its designated pad on the board.

Managing Trays and Tool Adjustments

As necessary, an automatic tool changer will switch to various nozzles tailored for different components. In the event of a defective part, the machine discards it and retrieves the next from the feeder. Various feeders are designated for different component types, such as reels for high-volume items, tubes for larger components, and trays for specifically configured components like ball-grid arrays (BGAs).

This automated tray handling enables us to preload numerous trays, allowing our SMT pick and place machines to operate autonomously. The Mycronic SMT lines feature the industry's swiftest changeover times, incorporating tests for passive component values and diode polarities upon new reel loading to minimize waste and rework.

We implement line control software to optimize feeder loading across jobs, associating barcodes from each component reel, tube, or tray with their respective feeders to ensure robust traceability. Essentially, Z-AXIS maintains the capability to store, manufacture, and date-code every specific batch of SMT assemblies produced.

Efficiency in SMT Lines with MY300HX Mycronic Machines

Within our SMT pick and place lines, we employ two distinct pick and place machines to fully assemble each board. Our line balancing software leverages input from board layout files to determine which machine performs the component placements.

This setup not only enhances efficiency but typically allows the MY300HX, known as Mycronic's fastest model, to place smaller components at rates reaching 33,000 parts per hour, while handling larger or uniquely shaped parts efficiently at 10,000 parts per hour.

Post-Pick and Place Processes

The following stage in the production line involves a reflow oven, where the solder melts and fuses with the components, creating secure electrical connections. Subsequently, each board undergoes an automated optical inspection to ensure quality.

After this inspection, various steps can follow according to the assembly requirements, including repeating the SMT pick and place process on the reverse side, cleaning, de-paneling, or incorporating through-hole components either by machine or hand.

Finally, each printed circuit board assembly is subjected to a burn-in process and receives a protective conformal coating before being packaged in custom trays for shipping. Z-AXIS offers additional materials and videos on these processes, inviting you to explore our services and reach out to discuss your specific electronics requirements.

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