Sputtering Targets for Research & Production

At present, the market for sputtering targets is being propelled by the growing global demand, acting as a catalyst for innovation within the glass industry. Manufacturers are increasingly leveraging advanced sintering methods, including sintered glass and advanced glass formulations, to enhance the quality and efficacy of their sputtering targets. Notably, companies focused on deep-glass technologies and traditional glass manufacturing are looking to bolster their production capabilities for coated glass. [Sources: 6, 9] The market for sputtering products can be categorized into three primary segments based on material types: glass, glass products, and glass components. This product spectrum encompasses sputtering targets as well as their respective components and applications throughout the glass industry. [Sources: 2, 6] In certain instances, manufacturers may opt to create segmented targets linked via custom joints; however, larger sputtering targets are a requirement for several facilities. Metals essential in forming the conductive layers predominantly used in the industry include AEM deposition, which acts as a barrier between the target’s surface and the conductive layer. The materials serve as barrier layers and consist of diverse target materials utilized for coatings and industrial tools. These can also incorporate various other substances such as ceramics, polymers, and metals. [Sources: 0, 3, 8] In many situations, used or discarded tantalum targets are not directly reclaimed by tantalum metal producers to fabricate new ingots for sputter target manufacturers. Instead, these materials are often processed by scrap dealers like Exotech, who provide payouts for their utility. Consequently, the compensation offered to a sputter target manufacturer for a second-hand tantalum target surpasses that for tantalum scrap from other sources. Thus, higher payouts for tantalum targets are observed from scrap dealers, coupled with increased prices for the targets themselves due to their use as substitutes for ore. [Sources: 13] To ensure high-integrity film deposition during reactive sputtering, low-oxygen metal powders are necessary, which are usually derived from alternative metal components. Producing sputtering targets from precious metals is inherently cost-intensive due to the extensive refining processes involved. [Sources: 7, 10, 12] With appropriate processing techniques, powders can achieve the electrical conductivity necessary for a tantalum sputtering target, often exceeding that of the ingot material. Sputtering targets manifest as thin layers generated through the sputtering technique. They find application in producing high-performance electronics and various other materials. These targets might consist of processed metals and ceramics and also be suited for producing electronic components. [Sources: 3, 7, 11] As previously discussed, two primary types of targets are utilized, with the magnetron sputtering technique employed for TCO segregation and cold spraying. Chromium (Cr) and chromium dioxide (CrO2) targets have been conventionally applied to create black matrices for flat-panel displays, devoid of health or environmental hazards. Cold spraying can sometimes be applied to coat extensive areas, particularly as traditional manufacturing techniques often yield sputtering targets that are smaller than required for numerous applications. Additionally, the majority of sputtering target materials comprise metallic elements and alloys; however, certain ceramic targets can produce thinner coatings that are hardened with various tools. [Sources: 1, 4, 8] The carrier material thickness of the target should be optimized to align with the sputtering target’s requirements. Sputter Targets and carrier plates also possess versatility in various applications, such as in semiconductor and optoelectronic fields. Various types of carrier targets are available to produce sputter targets and additional materials. [Sources: 7] The powder employed to forge the metallurgical item may possess purity in relation to the metal. Ions utilized for bombarding the sputterer may also be embedded within MoO3 films, sparking reactive sputtering (Mo) in the target. This process facilitates excellent thin film creation and superior purity of materials. [Sources: 1, 7, 8] Molybdenum sputter targets dominate a significant sector in the coating industry owing to their precision during the sputtering process. The applications for sputter targets are extensive; however, the most frequent usages range from high-performance coatings in industrial settings to the fabrication of premium ceramics for the automotive industry. [Sources: 5, 9] The escalating demand for sputtering targets, coupled with the heightened utilization of powerful electronics within the automotive sector, has significantly driven revenue in the Asia-Pacific sputtering target market. The proliferation of integrated circuits and advanced technologies like smartphones and tablets has generated a surge in demand for sputtering targets in this region. [Sources: 9]

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Sputter targets typically come in rectangular or circular shapes, though alternative configurations can also be produced. For instance, gold (Au) sputtering targets can be crafted into various forms, including customized shapes tailored to the intended application of thin layers. Generally, the variability within these sputter targets results in a "sputter film" that may lack the consistency desired for most semiconductor and optoelectronic functions.

An inquiry has arisen regarding a Barium Hexaferrite 2-inch Sputtering Target without a copper backing plate, emphasizing the need for high density for potential use in Laser Ablation in PLD. Please provide a quotation for this target alongside an estimated delivery timeframe. We seek a highly dense Barium Hexaferrite target with a diameter of 2 inches and a thickness of 0.25 mm.

Understanding Sputtering Targets

Sputtering targets are essentially thin disks or sheets composed of specific materials utilized in a process called sputtering to deposit thin films onto a substrate, such as a silicon wafer. Sputtering entails the physical ejection of atoms from the target’s surface when bombarded with ions, leading to their deposition on a substrate.

These targets have broad utility across numerous sectors, including microelectronics, thin-film solar cells, optoelectronics, and decorative coatings.

In the microelectronics sphere, sputtering targets are employed to lay thin films of materials, including aluminum, copper, and titanium, onto silicon wafers to manufacture crucial electronic devices like transistors, diodes, and integrated circuits.

As for thin-film solar cells, sputtering targets are vital for depositing efficient materials such as cadmium telluride, copper indium gallium selenide, and amorphous silicon onto substrates to create high-efficiency solar cells.

In the optoelectronics field, targets deposit materials like indium tin oxide and aluminum zinc oxide onto substrates, forming transparent conductive coatings for LCDs and touchscreens.

Furthermore, sputtering targets are also used to create decorative coatings by depositing thin films of materials, including gold, silver, and chrome, onto diverse substrates, culminating in decorative finishes for automotive components, jewelry, and more.

In essence, sputtering targets are vital for various applications because they enable precise and uniform deposition of thin films on multiple substrate types.

Below are some sputtering targets currently in stock:

Item

Specification

Quantity

1

CST-01-Cobalt Sputtering Target

Cobalt (Co), Purity: 99.95%: Diameter: 1 inch, thickness: 0.125 inch

1 No.

2

AKN-NiFe-Ni80Fe20

Ni80Fe20 sputter target, Purity: 99.95%: Diameter: 2 inch, thickness: 0.125 inch

1 No.

3

AKN-NiFe-Oneinch-Ni80Fe20

Ni80Fe20 sputter target, Purity: 99.95%: Diameter: 1 inch, thickness: 0.125 inch

1 No.

4

AKN-WS2-WS2

WS2 sputter target, Purity: 99.9%: Diameter: 1 inch, thickness: 0.125 inch, with Cu backing plate

1 No.

5

AKN-Gd2O3-Gd2O3

Gd2O3 sputter target, Purity: 99.9%: Diameter: 1 inch, thickness: 0.125 inch, with Cu backing plate

1 No.

Interested in exploring semiconductor sputtering? Reach out for an expert consultation today!

Applications of Sputtering Targets

Sputtering targets represent metallic elements used extensively in sputtering processes. They can vary significantly in size, ranging from small, one-inch squares to extensive lengths of over a yard. Smaller sputtering targets typically measure less than a centimeter in diameter, while larger targets are often necessary for certain machinery. The sputtering process necessitates that the metal target be segmented into designated shapes and sizes.

The primary function of a sputtering target is to enable the deposition of thin films through physical vapor deposition (PVD). Atoms from the target are removed and collide with the metal to create a coating. The resulting atoms convert to gas and solidify to form a thin film, which is then deposited. Due to the high accuracy of sputtering, it is an exceptional method for producing precision-engineered products.

Historically, sputtering targets are usually rectangular or circular, but advancements have made it possible to create specialized shapes for contemporary needs. Manufacturers often produce tailored configurations to meet customer specifications. The rotating target, resembling a long cylinder, offers enhanced thin film deposition precision. An increased surface area of the rotating sputtering target leads to accelerated deposition rates.

The applications for sputtering targets extend significantly, especially in thin film deposition, a straightforward method involving a target with a precise composition. The material deposited on the target subsequently transfers to the substrate and hardens to create the thin film. This process, recognized as film sputtering, results in a varied selection of shapes and patterns.

Vacuum coating equipment utilizes sputtering targets during thin film deposition. The PVD technique allows for the development of thin films by facilitating electron transfer between atoms, commonly referred to as sputtering. A target must be both flexible and rigid, with rotating variants yielding greater efficiency and higher output.

While sputtering systems can accommodate a wide variety of materials, compatibility issues arise with certain substances based on the melting point of the target material. Some sputtering targets are non-conductive and require protective coatings, while others are incompatible and should be avoided.

A thermal sputtering target operates using metal elements and aims to form thin film layers via PVD atoms. The heat generated during sputtering expedites bonding with the substrate, resulting in thin film formation.

The sputtering process generates valuable materials. Sputtering targets are typically constructed from precious metals, allowing for aluminum deposits onto substrates. The resultant metal is then classified as the “target.” This method is termed sputtering. Adequate sputtering equipment enables the coating of a metallic target with a thin PVD material layer.

Sputtering targets represent thin layers applied to substrates. Contrary to traditional sputtering machinery, sputtering targets may encompass both metallic and non-metallic forms. They can also be interconnected with alternative metals for added solidity. Beyond sputtering, these tools can be engraved or etched, making them ideal for high-fidelity imagery.

Regarding their application in thin films, sputtering targets are instrumental in semiconductor production, often utilizing metallic alloys to fabricate conducting layers. Consequently, sputtering targets must deliver consistency in chemical purity and metallurgical uniformity.

Silicon Sputtering Targets

Silicon sputtering targets result from the sputtering process of metal from silicon ingots. Various methods and processes—including electroplating, sputtering, and vapor deposition—can manufacture these targets. Preferred methods often include additional cleaning and etching processes to attain optimal surface conditions. The resultant targets possess high reflectivity, roughness less than 500 Angstroms, and relatively quick ignition rates. Films produced from silicon targets maintain low particle counts.

Silicon sputtering targets are pivotal for applying thin films to silicon-based substances. They find common application in displays, semiconductors, optical technologies, optical communication, and glass coating tasks. Additionally, they are suitable for etching intricate components in advanced technologies. N-type silicon sputtering targets find utilities across various sectors such as electronics, solar cells, semiconductors, and display technologies.

Silicon sputtering targets act as devices for material deposition onto surfaces, primarily composed of silicon atoms. The sputtering procedure necessitates precise material quantities; such accuracy can be challenging. Utilizing an ideal sputtering apparatus is crucial for producing silicon-based components, noting also that this process does not incorporate a silicon sputtering target.

Optical or Stress Data for Sputtering Silicon Wafers

A frequent inquiry regarding sputtered silicon concentrates on the optical or stress-related data. Although diode-sputtered films may lack specific data, insights can be derived regarding the film’s reaction under high-stress levels and identifying the appropriate microstructure for designated applications. For instance, evaluations can focus on the stress-thickness interrelation of films based on their thickness and resistivity.

In general terms, sputtered silicon tends to exhibit compressive stress. Enhanced surface diffusion is often observed due to elevated substrate temperatures. However, this effect may not be substantial enough to form a nanocrystalline phase and account for variations in kinetic energy. The stress data available can assist in ascertaining optimal deposition conditions for silicon films. The Thornton model serves as one approach to determine these optimal conditions.

The first step in this process involves identifying the substrate's working pressure. Amorphous silicon has shown low mechanical loss at lower working pressures, with mechanical loss increasing at elevated temperatures. Moreover, changes in working pressure influence RMS values, often resulting in rougher films displaying a columnar microstructure—an observation consistent with Thornton’s structure zone model, highlighting its advantages.

The second aspect to assess is substrate temperature. High initial substrate temperatures may excessively influence Pt-sputtered silicon. Diffusion barriers fail to retain for Pt-sputtered silicon, jeopardizing insulating properties of the underlying silicon. This outcome ultimately decreases energy demands in device processing. Therefore, determining the optimal working temperature of the silicon substrate is crucial.

Sputtering (sputter deposition) is a widely embraced thin film deposition technique across various industries, renowned for producing films of exceptional uniformity, density, purity, and adhesion on diverse surfaces. This process entails ejecting atoms from a target or source material intended for deposition onto a substrate.

Sputtering targets, as the source of plating material utilized in this process, are fundamental for sputter deposition. Typically, most sputtering target materials comprise metallic elements or alloys. Ideally, a target should be entirely consumed once the sputtering process concludes. However, due to inefficiencies, residual valuable metals often remain on spent sputtering targets. These targets can no longer support production, and reclaiming remaining metals is arduous and costly.

Given that most utilized sputtering targets hold leftover precious metal, preserving and recycling these materials becomes imperative. Expertise and appropriate technologies are essential for effectively managing and processing spent sputtering targets to ensure maximum value reclamation. Globe Metal® stands as a global leader in metal recycling, distinguished by considerable experience in repurposing used sputtering targets. Acknowledging the significance of rare metals across various sectors (such as aerospace, semiconductor manufacturing, and display technologies), we ensure that these valuable metals stay functional through our recycling initiatives. We prioritize the recovery of superior quality minor and primary metals, ferroalloys, high-temperature alloys, and specialty steels, reintegrating them into the economy. Globe Metal® maintains ISO certification, providing recycling documentation upon request.

The value derived from spent sputtering targets fluctuates based on the nature of the plating metal and the presence and quantities of secondary metals. To ensure accurate evaluation, it is advisable to send materials to a qualified metal recycler such as Globe Metal® for thorough testing.

Standard Procedures:

1. Comprehend the client's materials through photos, analyses, or testing;
2. Globe Metal® submits pricing quotations based on various recycling options;
3. Material is collected from the client's facility, sorted, cleaned, and processed;
4. Globe Metal® circulates metals for recycling via an international network, providing proof of destruction or recycling certificates.

For inquiries related to any metal or to explore how your company can benefit from our rewarding recycling program, feel free to contact an expert at 1-800-700- or.

Globe Metal® proudly belongs to the Minor Metals Trade Association and the Mining Suppliers Trade Association Canada.

For additional sio2 sputtering information, reach out to us. We are here to provide professional assistance.